BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template - iPhone 6s/6s Plus
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Tootekood: 090602543A
Seisund: OEM
Osade tüüp: Teised
Brutokaal: 0.011kg
Mahumass: 0.009kg
Pikkus: 10.000cm, 0.500cm
Laius: 8.000cm
Kaal: 0.010kg
EAN:
Jaepakenditega: Jah
Lisatud pakend: Jah
Maaletooja: Commerce Trading OÜ*Tootepildid on illustratiivsed
Eeldatav kättetoimetuse aeg (DPD, Smartpost, Omniva): 14.04.2024 Laoseis:
Tootjapoolne kirjeldus
BST-A9 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone 6s/6s Plus
Made by high quality steel material
The stepped grooves can quickly adjust the tin sweating location of IC beads
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing