BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template - iPhone X
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Tootekood: 090602561A
Seisund: OEM
Osade tüüp: Teised
Brutokaal: 0.034kg
Mahumass: 0.072kg
Pikkus: 10.000cm, 4.000cm
Laius: 8.000cm
Kaal: 0.030kg
EAN:
Jaepakenditega: Jah
Lisatud pakend: Jah
Maaletooja: Commerce Trading OÜ*Tootepildid on illustratiivsed
Eeldatav kättetoimetuse aeg (DPD, Smartpost, Omniva): 03.05.2024 Laoseis:
Tootjapoolne kirjeldus
BST-1023A 3D Planting Tin Network Mesh IC Chip BGA Reballing Solder Template for iPhone X
Made by high quality steel material
The stepped grooves can quickly adjust the tin sweating location of IC beads
Easy and quickly for reballing the BGA IC
Excellent to replace IC or BGA rework reballing